Asus TUF B365M PLUS GAMING Motherboard

Asus TUF B365M PLUS GAMING Motherboard

CPU

• Intel® Socket 1151 9th / 8th Gen Intel® Core™, Pentium® Gold and Celeron® Processors
• Supports Intel® 14 nm CPU
• Supports Intel® Turbo Boost Technology 2.0
• The Intel® Turbo Boost Technology 2.0 support depends on the CPU types.
• Refer to www.asus.com for CPU support list

Chipset

• Intel® B365

Memory

• Intel® B365 Chipset
• 4 x DIMM, Max. 64GB, DDR4 2666/2400/2133 MHz Non-ECC, Un-buffered Memory
• Dual Channel Memory Architecture
• Supports Intel® Extreme Memory Profile (XMP)
• Refer to www.asus.com for the Memory QVL (Qualified Vendors Lists).
• The maximum memory frequency supported varies by processor
• ** DDR4 2666MHz and higher memory modules will run at max. 2666MHz on Intel® 8th Gen. 6-core or higher processors.

Graphic

• Integrated Graphics Processor- Intel® HD Graphics support
• Multi-VGA output support : HDMI/DVI-D/DisplayPort ports
  • Supports HDMI with max. resolution 4096 x 2160  @ 30 Hz
  • Supports DVI-D with max. resolution 1920 x 1200  @ 60 Hz
  • Supports DisplayPort 1.2 with max. resolution 4096 x 2304  @ 60  Hz
• Maximum shared memory of 1024 MB (for iGPU exclusively)
• Supports Intel® InTru™ 3D, Quick Sync Video, Clear Video HD Technology, Insider™
• Supports up to 3 displays simultaneously

Multi-GPU Support

• Supports AMD CrossFireX™ Technology

Expansion Slots

• 1 x PCIe 3.0 x16 (x16 mode)
• 1 x PCIe 3.0 x16 (max at x4 mode)
• 1 x PCIe 3.0/2.0 x1

Storage

• Intel® B365 Chipset :
• 1 x M.2 Socket 3, with M key, type 2242/2260/2280 storage devices support (SATA & PCIE 3.0 x 4 mode)
• 1 x M.2 Socket 3, with M key, type 2242/2260/2280 storage devices support (PCIE 3.0 x 4 mode)
• 6 x SATA 6Gb/s port(s), gray
• Support Raid 0, 1, 5, 10
• Intel® Optane™ Memory Ready

LAN

• Intel® I219V, 1 x Gigabit LAN
• TUF LANGuard

Audio

• Realtek® ALC1200 8-Channel High Definition Audio CODEC
  • Supports : Jack-detection, Front Panel Jack-retasking
• Audio Feature :
  • Audio Shielding: Ensures precision analog/digital separation and greatly reduced multi-lateral interference
  • Dedicated audio PCB layers: Separate layers for left and right channels to guard the quality of the sensitive audio signals
  • Premium Japanese audio capacitors: Provide warm, natural and immersive sound with exceptional clarity and fidelity
• Choose the chassis with HD audio module in front panel to support 8-channel audio output.

USB Ports

• Intel® B365 Chipset :
• 6 x USB 3.1 Gen 1 port(s) (4 at back panel, blue, 2 at mid-board)
• Intel® B365 Chipset :
• 6 x USB 2.0/1.1 port(s) (2 at back panel,4 at mid-board)

Back I/O Ports

• 1 x PS/2 keyboard/mouse combo port(s)
• 1 x DVI-D
• 1 x DisplayPort
• 1 x HDMI
• 1 x LAN (RJ45) port(s)
• 4 x USB 3.1 Gen 1 Type-A up to 5Gbps
• 2 x USB 2.0
• 1 x 8-channel Audio I/O

Internal I/O Ports

• 1 x Addressable RGB header
• 1 x Aura RGB Strip Header
• 1 x USB 3.1 Gen 1(up to 5Gbps) connector(s) support(s) additional 2 USB 3.1 Gen 1 port(s) (19-pin, moss green)
• 2 x USB 2.0 connector(s) support(s) additional 4 USB 2.0 port(s)
• 2 x M.2 Socket 3 for M Key, type 2242/2260/2280 devices
• 1 x COM port(s) connector(s)
• 6 x SATA 6Gb/s connector(s)
• 1 x CPU Fan connector(s)
• 2 x Chassis Fan connector(s)
• 1 x S/PDIF out header(s)
• 1 x 24-pin EATX Power connector(s)
• 1 x 8-pin EATX 12V Power connectors
• 1 x Front panel audio connector(s) (AAFP)
• 1 x Clear CMOS jumper(s)
• 1 x System panel connector